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Ic Memory, It Component & Solution Provider

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ú°决Û°äÐÞÀ业Ý»为ðí储ÐïÚâ导体产ù¡ûùð«Íêá¶âÍîÜú°决Û°äÐ (Solution).
 
◼ 测试
1.NAND TEST

1) Die Test

2) Discrete Test : TSOP, BGA, ETC

3) NAND, DRAM, eMMC, eMCP

 
2.DRAM TEST

- DDR3, DDR4, LPD3, LPD4

◼ ð¤ðã
1.NAND PACKAGE : TSOP, BGA
2.Finished OEM Products

1) NAND Memory OEM

2) DRAM Memory Module OEM

 
◼ Arranging
1.DSP(Design solution Partner) Arranging
2.Fab Arranging
3.Sensor
4.Power Semiconductor
5.SoC (System on Chip)
Solution Business

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